Mihai Lefter

PhD student at the Computer Engineering Group of the Faculty of Engineering, Mathematics and Computer Science (EEMCS/EWI), Delft University of Technology.


3DIM3: (b) 3D memory hierarchy
3DIM3 (3D-TSV Integration for Multimedia and Mobile applications) aims at providing novel system architectures and design methodologies tailored for the specific challenges and opportunities provided by the emerging 3D TSV integration technology.


3D memory  hierarchies (physical and logical location of caches, implementation, etc.), in the context of multi-media and mobile applications.

Publications Mihai Lefter

Please note: This page contains links to PostScript files of articles that may be covered by copyright. You may browse the articles at your convenience. (In the same spirit as you may read a journal or a proceeding article in a public library). Retrieving, copying, or distributing these files, however, may violate the copyright protection law. We recommend that the user abides international law in accessing this article list.


  1. M. Lefter, G.R. Voicu, T. Marconi, V. Savin, S.D. Cotofana, LDPC-Based Adaptive Multi-Error Correction for 3D Memories1641_ldpcbased_adaptive_multierror_correction_for_3d_memories.pdf (September 2017), 35th IEEE International Conference on Computer Design (ICCD 2017), 5-8 November 2017, Boston, USA [Conference Paper]
  2. M. Lefter, T. Marconi, G.R. Voicu, S.D. Cotofana, Low Cost Multi-Error Correction for 3D Polyhedral Memories1640_low_cost_multierror_correction_for_3d_polyhedral_memories.pdf (July 2017), IEEE/ACM International Symposium on Nanoscale Architectures (NANOARCH 2017), 25-26 July 2017, Newporrt, USA [Conference Paper]
  3. 2016

  4. M. Enachescu, M. Lefter, G.R. Voicu, S.D. Cotofana, Low-Leakage 3D Stacked Hybrid NEMFET-CMOS Dual Port Memory (July 2016), IEEE Transactions on Emerging Topics in Computing, DOI: 10.1109/TETC.2016.2588725 [Journal Paper]
  5. 2015

  6. M. Lefter, G.R. Voicu, S.D. Cotofana, A Shared Polyhedral Cache for 3D Wide-I/O Multi-Core Computing Platforms1478_a_shared_polyhedral_cache_for_3d_wideio_multicore_comput.pdf (May 2015), IEEE International Symposium on Circuits and Systems (ISCAS 2015), 24-27 May 2015, Lisbon, Portugal [Conference Paper]
  7. 2014

  8. M. Lefter, M. Enachescu, G.R. Voicu, S.D. Cotofana, Energy Effective 3D Stacked Hybrid NEMFET-CMOS Caches1582_energy_effective_3d_stacked_hybrid_nemfetcmos_caches.pdf (July 2014), 10th ACM/IEEE International Symposium on Nanoscale Architectures (NANOARCH 2014), 8-10 July 2014, Paris, France [Conference Paper]
  9. 2013

  10. G.R. Voicu, M. Lefter, M. Enachescu, S.D. Cotofana, 3D Stacked Wide-Operand Adders: A Case Study1586_3d_stacked_wideoperand_adders_a_case_study.pdf (June 2013), 24th IEEE International Conference on Application-Specific Systems, Architectures and Processors (ASAP 2013), 5-7 June 2013, Washington D.C., USA [Conference Paper]
  11. M. Enachescu, M. Lefter, A. Bazigos, A. Ionescu, S.D. Cotofana, Ultra Low Power NEMFET Based Logic1589_ultra_low_power_nemfet_based_logic.pdf (May 2013), IEEE International Symposium on Circuits and Systems (ISCAS 2013), 19-23 May 2013, Beijing, China [Conference Paper]
  12. M. Lefter, G.R. Voicu, M. Taouil, M. Enachescu, S. Hamdioui, S.D. Cotofana, Is TSV-based 3D Integration Suitable for Inter-die Memory Repair?1328_is_tsvbased_3d_integration_suitable_for_interdie_memory_r.pdf (March 2013), Design, Automation & Test in Europe Conference & Exhibition (DATE 2013), 18-22 March 2013, Grenoble, France [Conference Paper]
  13. 2012

  14. M. Taouil, M. Lefter, S. Hamdioui, Exploring Test Opportunities for Memory and Interconnects in 3D ICs1337_exploring_test_opportunities_for_memory_and__interconnects.pdf (December 2012), International Design & Test Symposium (IDT 2012), 15-17 December 2012, Doha, Qatar [Conference Paper]
  15. S. Safiruddin, M. Lefter, D. Borodin, G.R. Voicu, S.D. Cotofana, Zero-Performance-Overhead Online Fault Detection and Diagnosis in 3D Stacked Integrated Circuits1308_zeroperformanceoverhead_online_fault_detection_and_diagno.pdf (July 2012), IEEE/ACM International Symposium on Nanoscale Architectures (NANOARCH 2012), 4-6 July 2012, Amsterdam, The Netherlands [Conference Paper]
  16. S. Safiruddin, D. Borodin, M. Lefter, G.R. Voicu, S.D. Cotofana, Is 3D Integration The Way to Future Dependable Computing Platforms?1307_is_3d_integration_the_way_to_future_dependable_computing_pl.pdf (May 2012), 13th International Conference on Optimization of Electrical and Electronic Equipment (OPTIM 2012), 24-26 May 2012, Brasov, Romania [Conference Paper]
Mihai Lefter