Quantum Engineering Colloquium


1. Moritz Fieback,  TU Delft, The Netherlands -- 04-04-2018

2.  Amir Mirzagheytaghi, TU Delft, The Netherlands -- 04-04-2018


 1.   Spice-based Radiation Model

Electronics in space suffer from increased wear-out due to the accumulation of high concentrations of ionizing dose. The costs of a space mission in combination with the harsh space environment force space agencies to demand electronic components with extreme high reliability to guarantee mission success. One of the main reliability concerns for DRAM is the retention time degradation due to radiation, as radiation increases the Gate Induced Drain Leakage (GIDL). In this work we present a methodology to develop a Spice-based radiation model that could be used to simulate this retention time degradation. The model estimates the GIDL based on existing silicon measurements of the retention time and gives designers the opportunity to measure the impact of radiation during the design stage. Simulation results show a strong retention time degradation for small Total Ionizing Dose (TID) while this stabilizes with larger TID. The application of the model with space radiation environment data shows that the damage that spacecrafts suffer depends strongly on altitude and aging time.    

2.  Qubit Integration

Superconducting vertical interconnect for qubit integration 3D integration with vertical interconnect access (VIA) has been widely used in semiconducting devices due to smaller package size, higher interconnection density, and better performance. Typical 3D-Via applications include MEMS, CMOS image sensor, stacked memories, hybrid memory cube, Sensors, RF filters and photonic. Introducing the Super Conducting VIA (SC-VIA) technology for scalable quantum integrated circuit architecture opens up new window in applications. While the field of via process is well-developed for integrated circuits, relatively little work has been performed to determine the compatibility of the associated processes with superconducting qubits. In this talk, we present the benefits of using via in quantum circuits, modification of conventional fabrication process according to compatibility requirements, and also possibility of using superconductor in conventional interconnects.





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